Electric inductance,Choke Coil

OUR COMPANY
Technical Roadmap For 3L Electronic Corp. 1977~

1977 3L Electronic Corp. Established in Taipei,Taiwan.

1983 Approved by Taiwan Military Service for Inductor & Coil Products.

1989 Set up first China factory in Zhuhai, Guangdong. Introduced firstly the Conformal Coated Inductors (Color Code Inductors) in Taiwan Market & fully adapted auto production equipment to achieve low cost/high volume requirement , Formed Technology team for Molding/Manufacturing, Equipments/Production tooling Development.

1990 Integrated & Focused on Winding Inductor & coil products. Adapted CNC winding machines for High Inductance/Low Frequency applications.

1992 Firstly Introduced High Frequency Molding Coils. Successfully Integrated Ferrite & Iron Powder core supply chain nearby 3L’s location for Raw Material Development.

1993 Developed Complete Production lines of Iron Powder Chokes & High Flux/MPP Choke products, Founded a new factory.

1994 Introduced automatic Toroid winding machines for high-turns requirement applications & automatic Wire Stripping Process for Bold wire applications.

1995 Began to produce Ceramic Drum Core. Introduced Radial Inductor automatic Taping machines & High-Speed Bead Assembling lines.

1996 Launched SMT Power Inductor / SMD Winding Chip Products in Global Market.

1998 Firstly Introduced Lead Free SMT Toroid choke process for Texas Instrument Inc. Introduced Ceramic Winding Chip inductor for Cellular phone / wireless communication application.

1999 Introduced Molded Winding Ferrite Chips series (SMD32/45/56/63) in Market. Used Spot Soldering Technology on high reliability required Thin Wire applications. (Compact Structure Design).

2000 Introduced Various Low-Profile Shielded Power Choke applications in Global Market. Adapted Electric Plating for Terminal Processing to increase soldering reliability.

2001 Further developed Minimized dimensions for all SMT/SMD series. Adapted High-Speed Pin Attaching Machines for Dip type product application. (220 pcs/ min). Developed Multilayer Bead/ Inductor products.

2002 Set up a Reliability Test Lab in New factory which contains Thermal Shock Test Chamber, High Temp/Humidity Test Chamber, Salt Water Spraying Tester, Vibration Test machine, Drop Test Machine, Push/Pull Strength for X-Y-Z Axial Test Machine, Peeling Strength Tester for SMT/SMD Reel Packaging, Nitrogen Reflow Soldering Machine, Simulated SMT assembly line, Density Tester, Hi-Pot Tester, X-Ray Material Analyzer etc.. Formed fully automatic production lines for SMTSDR manufacturing; Simultaneously Promoted 5S Exercise and Developed Lead Free/RoHS compliance products.

2003 Formed fully automatic production lines of Flat Wire Power Choke (SMTER, SMTBW Series) for CPU application. Developed Low Profile SMT Power Choke (SMTDRRI2D/3D/4D/5D) / Common Mode choke (SMDWCM) applications. Developed Balance Score Card (BSC) Strategic Management system in 3L. Adapted Gauge R&R /MSA /SPC /FMEA /PPAP/ APQP tools in 3L. Set up a new branch in Su Zhou for future Expanding. Developed Thin Film / Ceramic Miniature Multilayer products. Produced Aluminum/ Copper cores in house.

2004 Developed Terminal Plating production including Ag/Ni/Sn Layer processing, Expanded Molded Base Production lines for further decreasing Raw Material Costs. Began to produce Planar Xfmrs. Developed High Speed Winding /Soldering/ Terminal treating machine (0.6 sec/pcs) and Fully automated Marking /Testing /Packaging machines (0.5 sec/pcs) for winding chip product. Purchased a land of 48,000 Square Meter for future factory expanding. Developed LTCC associated products (High/Low Pass Filter, Duplex, Balun, Antenna).

2005 Developed Ultra Low Profile Power Choke (0.8mm Height Max) and various miniature power choke products for portable products. Integrated automatic production line and raised winding chips capacity to 20 Million. Executed Blue Sea Strategy on developing new application area. Awarded ISO14000 and GPMS Certificate. Opened new factory for Electric Plating.

2006 Switched all 3L products into RoHS compliance products. Successfully Finished Design Stages for BRI (Low Profile Power Chokes produced by 100% Automation Lines), SMDV (Molded Winding Chips), SMTPI (Molded Iron Powder Power Chokes), Planar Xfmrs products. Achieved 9,000,000 Monthly capacity for SMTSDR winding chip series.

2007 Developed Low profile High current/Molded Power Chokes. Expanded SMDV series to 25/20 series & Magnetic Epoxy packaging. Expanded BRI series to lowest profile as 0.7mm. & wider application for unshielded type & magnetic epoxy packaging type.

2008 Obtained Sony GP and QC080000 certificate. Started to develop Overmold Iron Powder high DC current inductor (DIP and SMD type) for CPU power choke application ,SMD type including UPIA/UPIB/UPIC. Type UPIA working frequency up to 1MHz , 3MHz for UPIC ,5MHz for UPIB ; DIP type including HFPI type for high frequency /high current Power choke application.

2009 Started mass production for Overmold Iron Powder high current inductor, SMD type ranges UPIA0603/0604/1004/1005/1203/1205/1207 ,and DIP includes DPI1210. Developed open magnetic circuit BDR series inductor for lower power choke, by auto-production. Developed magnetic resin coated BDE series inductor, by auto-production. Developed high DC current power choke HCL1310, featuring lowest DCR with copper foil winding.

2010~2011 Obtained ISO16949 certificate. Became supplier of component for Automotive Infotainment System to Hyndai, Daewoo. Developed Second-Powder-Filling process for ultra thin UPI manufacturing technology, Lower product profile to 1.2mm min. Developed new powder formulations for better High Temperature Storage performance. Developed multiple coil layer winding technology. Set up FAE center for Field Application analysis. Fully promote lean production. Founded equipment center to develop auto- equipment with the aid of Japanese consultant.
Successfully developed power supply manufacturer Power1 and Efore.
Promote E-learning and Cloud technology developing.

2012 Further developed manufacturing technology for Overmold Iron Powder products. Applied 7 cavities/mold to increase capacity. Introduce new αwinding method to reduce DCR. Developed new 170 Deg C type powder formulation to achieve 50M Ohm Core resistance requirement. Replaced labor demanding operation with robot arms to further full auto manufacturing. Adopted multiaxial structure controllers for 8~16 axis winding/soldering automation.

2013 Develop 180 Deg. C type powder formulation and large size, low profile structure Overmold product. Further develop high end Power choke for Power supply, LED lighting, Electrocar, HEMS(Home Energy Management System), Automotive/Electronic equipment market.